000 | 00782nam a22002177a 4500 | ||
---|---|---|---|
999 |
_c47792 _d47792 |
||
001 | 2419 | ||
003 | OSt | ||
005 | 20161104173614.0 | ||
007 | ta | ||
008 | 151110b xxu||||| |||| 00| 0 eng d | ||
041 | _aeng | ||
082 |
_a621.381 _bO658 |
||
100 | 4 | 0 |
_aCoburn, J. W. _911870 |
245 | 0 |
_aPlasma etching and reactive ion etching / _cJ. W. Coburn |
|
260 |
_aNew York : _bAmerican Institute of Physics, _c1982 |
||
300 | 4 | _a87 p. | |
505 | _a1. Introduction 2. Apparatus, terminology and parameters 3. The reactive gas glow discharge 4. Gas-Surface chemistry 5. Glow discharge process 6. The etching of aluminum 7. Plasma diagnostics and process control 8. Apparatus considetations. | ||
650 |
_aSemiconductors _97680 |
||
650 |
_aEtching _911872 |
||
942 |
_2ddc _cLOPT |